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The eMMC architecture puts the MMC components (flash memory plus controller) into a small ball grid array (BGA) IC package for use in circuit boards as an embedded non-volatile memory system. This is noticeably different from other versions of MMC as this is not a user-removable card, but rather a permanent attachment to the circuit board. eMMC also does not support the SPI-bus protocol.Almost all mobile phones and tablets use this form of flash for main storage. The latest version of the eMMC standard (JESD84-B51) by JEDEC is version 5.1 released February 2015, with speeds rivaling discrete SATA-based SSDs (400 MB/s).

Jeju Semiconductor is one of the world largest SRAM solutions provider for mobile applications

Since Jeju Semiconductor made a debut to the SRAM (Static Random Access Memory) market in 2001 with 4M SRAM, Jeju Semiconductor continued implementing full lineup of low power SRAM products through 1M, 2M, 4M to 8M SRAM.

Density	Stack	Part number	Vcc	Speed	Package Type	Type	Download
32Gb	4-stack	JSMC32DUS1AVAEA-H2	3.3V	HS200	153B (11.5mm x 13 mm)	TLC	NULL
32Gb	4-stack	JSMC32DUD1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL
32Gb	4-stack	JSMC32DUA1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL
16Gb	2-stack	JSMC16BUS1AVAEA-H2	3.3V	HS200	153B (11.5mm x 13 mm)	TLC	NULL
16Gb	2-stack	JSMC16BUD1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL
16Gb	2-stack	JSMC16BUA1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL
8Gb	1-stack	JSMC08AUS1AVAEA-H2	3.3V	HS200	153B (11.5mm x 13 mm)	TLC	NULL
8Gb	1-stack	JSMC08AUD1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL
8Gb	1-stack	JSMC08AUA1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL
4Gb	1-stack	JSMC04AUM1AVAED-H4	3.3V	HS400	153B (8.0mm x 10 mm)	TLC	NULL
4Gb	1-stack	JSMC04AUA1AVAEA-H4	3.3V	HS400	153B (8.0mm x 10 mm)	TLC	NULL
4Gb	1-stack	JSMC04AUA1HYAEA-H4	3.3V	HS400	153B (11.5mm x 13 mm)	MLC	NULL

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